Bummer! Haswell may run hot & require delid for better cooling
This initial news from FanlessTech is quite a bummer: On LGA 1150, Intel is using thermal paste between the silicon die and the heat spreader, no soldering like Sandy Bridge and previous generations. We are seriously worried about passive cooling now. So disappointing. via FanlessTech: The Haswell disappointment. 🙁 Looks like the word of the day is delid… as that seems to be what is necessary to really push Haswell temps down 🙁 And here are more details: Haswell Temp