Bummer! Haswell may run hot & require delid for better cooling
This initial news from FanlessTech is quite a bummer:
On LGA 1150, Intel is using thermal paste between the silicon die and the heat spreader, no soldering like Sandy Bridge and previous generations. We are seriously worried about passive cooling now. So disappointing.
Looks like the word of the day is delid… as that seems to be what is necessary to really push Haswell temps down 🙁 And here are more details:
1. VRMs are now on the cpu..VRM’s are voltage regulators… they heat up… on the board they were mosfets… u remember me tooting about having solid mosfets for high level overclocking….
2. The IHS was not caibrated properly with the node shrink.
This causes a gap between the IHS and node.
The cpu is also shown to not be soldered… so the IHS is not as good as the intel metal solder used in the earilier gens.